We are seeking a highly experienced Advanced Packaging Engineer with deep expertise in substrate layout, system integration, and packaging technologies.
This is a high-impact, on-site role focused on advanced organic substrate layout, routing feasibility, and co-design alignment across floorplanning, mechanical, and system-level constraints.
You’ll be part of a small, expert team shaping the physical implementation of a first-of-its-kind high-performance package.
This position is a hybrid role located in Saratoga, California.
Responsibilities of the Advanced Packaging Engineer:
Drive initiatives for advanced packaging technologies, including substrate layout and system-level integrationCollaborate closely with TSMC in Taiwan and local engineering teams to develop and implement packaging solutionsLead co-design efforts across electrical, mechanical, and thermal domains to ensure alignment with system-level constraintsEvaluate and optimize routing feasibility and substrate design for high-performance applicationsIntegrate advanced packaging technologies such as CoWoS into system architecturesSupport cross-functional teams in the development of 2.5D/3D stacking and heterogeneous integration solutionsQualifications of the Advanced Packaging Engineer:
+ years of experience in advanced packaging technology development and system integrationProven ability to wear multiple hats and lead cross-functional initiatives across global teamsDeep understanding of CoWoS technology and its application in high-performance systemsStrong system-level background with experience integrating packages into full systemsKnowledge of 3D stacking and heterogeneous integration (preferred)Bachelor’s degree in Mechanical Engineering, Electrical Engineering, or related fieldBackground in Materials Science is helpful; Master’s degree is a plusCompensation of the Advanced Packaging Engineer:
Salary Range: $, – $,, based on experienceLocation: On-site (U.S. based)Benefits: Medical, Dental, Vision, K, PTO, parental leave, and sick leave as required by lawApplication Details:
Job opens for applications on: /Applications will be accepted for at least days from the posting dateKeywords:
Advanced Packaging, CoWoS, Substrate Layout, System Integration, TSMC, 3D Stacking, Organic Substrate, High-Performance Computing, Mechanical Engineering, Electrical Engineering, Materials Science, Floorplanning, Routing Feasibility, Heterogeneous Integration
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