Failure Analysis Engineer

Job description

Job Description Job Description Overview: We are seeking a highly skilled and motivated Failure Analysis Engineer (FAE) to join our team.

The successful candidate will work directly with clients to ensure deliverables fall within the applicable scope and budget.

The role involves close collaboration with customers, as well as internal teams including Foxconn R&D, Product Engineering, and Quality Engineering.

This position focuses on identifying elevated factory and field failure symptoms, conducting in-depth circuit failure analysis, and determining root causes, leading to corrective actions that improve product quality and customer satisfaction.

Duties and Responsibilities: Sets up and tests the server/computer tray meet specified requirements.

Troubleshoots, debugs, and determines root cause at multiple system levels for customer devices.

Analyzes circuits and topologies to identify marginal failure root causes.

Drives recovery actions and repairs for failing devices.

Assist with engineering investigations of significant customer field and factory escalations related to hardware issues, ensuring timely resolution.

Develops, maintains, and improves all troubleshooting solutions within area or responsibility.

Works with various engineering groups to determine if the data indicates a need for process/product improvement and provides input on improvement opportunities.

Assists with the fabrication and development of new equipment, fixtures, and test programs.

Improves the Failure Analysis Procedure and supports cross-training.

Manage the relationship with the clients and in charge of client weekly/monthly/quarterly review meetings.

Cross-functional Collaboration: Work directly with design and manufacturing teams to investigate hardware issues down to the component level.

Internal Collaboration: Collaborate with multiple internal engineering disciplines (HW, SW, Diagnostics, Quality, Product, Mechanical, Materials, Reliability) to resolve complex hardware issues.

Understand optical FI workflow and work with our PFA team to guide sample-preparation development.

Willing to travel to customer site for support Skill/Knowledge Requirements: Familiarity with scripting languages for automation of processes/workflows - proficient in reading and interpreting assembly drawings, PCB schematics, oscilloscopes, multi meters and board layout.

Basic understanding of scan-chain based test Design for Testing (DFT) and some experience in operation Automated Test Equipment.

Excellent written and verbal communication skills, with the ability to effectively collaborate with multi-functional team(s).

Analytical Problem-Solving: Ability to isolate and resolve hardware failures, including safely injecting failures during debugging to pinpoint root causes.

Linux Knowledge: Working knowledge of Linux commands and structures, including exposure to SEL and IPMI tools.

Debugging Tools & Algorithm Development: Proficient in developing and debugging algorithms, creating test tools to assist with failure isolation, and documenting findings for team sharing.

Ability to work effectively in a team-oriented environment and independently when needed.

Experience in advanced technology nodes (e.g., 2nm or below).

Experience with EDA (Electronic Design Automation) tools and layout editing software.

Strong problem-solving skills with the ability to diagnose and resolve complex circuit issues Education and Experience: Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Physics, or a related field (or equivalent experience).

Minimum of three to five (3-5) years of experience in FA, at best with hands-on experience in technique enablement and development of supporting HW for Fault-Isolation and/or vacuum based microscopic systems (e.g., SEM, DMM).

Knowledge of failure analysis techniques and methodologies.

Familiarity with PCA, system, and RMA & service manufacturing environments.

Additional Requirements: Physical Requirements: Ability to perform various physical tasks such as walking, standing, bending, and lifting up to 20 lbs.

Must also be able to perceive depth, operate motor vehicles, and use equipment related to the job.

Work Conditions: The role may require working in environments with machines, electrical energy, and other potentially hazardous conditions.

Candidates should be flexible regarding irregular hours and travel by various means of transportation (car, van, bus, and airplane).

Willing and able to multitask, support other projects and businesses as needed.

Travel to customer sites required.

About FoxConn Assembly, LLC FoxConn Assembly, LLC has always adhered to the production and operation strategy of Deeply cultivated in China and Deployed globally, played the role of a bridge and link between domestic and foreign dual circulation, and vigorously promoted the digital transformation of the entire ICT industry chain.

After several years of development, it has become a leading enterprise in the global digital economy.

It ranks second in the world in the electronic manufacturing service industry, and continues to contribute to the high-quality development of the digital economy.

World's 2nd largest electronic manufacturing service industry 30 Fully automatic smart factories 190,000 Global Employees Fortune Global 500 - Ranked 22nd Global Views Monthly CSR & ESG Award - First Prize in the Category of Electronic Technology Industry Clarivate Top 100 Global Innovators - Awarded in 5 Consecutive Years FoxConn Assembly, LLC is an Equal Opportunity Employer (EOE).

All qualified candidates will receive consideration without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, or marital status in accordance with applicable federal, state and local laws.

FoxConn Assembly, LLC participates in E-Verify and will provide the federal government with your Form I-9 information to confirm that you are authorized to work in the U.S. Powered by JazzHR 2aLJ88XIJJ

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