IC Packaging Integration Engineer

Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences – from AI and data centers, to PCs, gaming and embedded systems.

Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary.

When you join AMD, you’ll discover the real differentiator is our culture.

We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives.

Join us as we shape the future of AI and beyond.

Together, we advance your career.

THE ROLE: We are looking for a candidate that can drive advanced 2.5D/3D IC packaging technology development with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology! THE PERSON: The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment.

He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills.

Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder.

KEY RESPONSIBILITIES: Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and to integrate packaging needs into product design.

Drive for supplier engagement on continuous improvement and new capabilities ahead of need Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders Drive external manufacturer on issue resolution and issue prevention Monitor and improve product yield and quality through collaboration with design and manufacturing teams Plan and execute change management from internal or external parties Involved in regional supplier management – drive to meet Key Performance Indices Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio Prepare & present Executive Summary of projects and supplier’s performance Coordination of activities within/external team to deliver critical metrics Overseas travel is required PREFERRED EXPERIENCE: Strong knowledge in Flip Chip Packaging (while operational experience in Advanced packaging areas, bumping process, substrates manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage) Track record of development work leading to volume production in Semiconductor manufacturing Good leadership and interpersonal skills Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive) ACADEMIC CREDENTIALS: Required: Bachelor's or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.

Preferred: PhD in a relevant engineering discipline.

LOCATION: Austin, TX #LI-SC3 #LI-Hybrid Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services.

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.THE ROLE: We are looking for a candidate that can drive advanced 2.5D/3D IC packaging technology development with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology! THE PERSON: The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment.

He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills.

Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder.

KEY RESPONSIBILITIES: Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and to integrate packaging needs into product design.

Drive for supplier engagement on continuous improvement and new capabilities ahead of need Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders Drive external manufacturer on issue resolution and issue prevention Monitor and improve product yield and quality through collaboration with design and manufacturing teams Plan and execute change management from internal or external parties Involved in regional supplier management – drive to meet Key Performance Indices Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio Prepare & present Executive Summary of projects and supplier’s performance Coordination of activities within/external team to deliver critical metrics Overseas travel is required PREFERRED EXPERIENCE: Strong knowledge in Flip Chip Packaging (while operational experience in Advanced packaging areas, bumping process, substrates manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage) Track record of development work leading to volume production in Semiconductor manufacturing Good leadership and interpersonal skills Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive) ACADEMIC CREDENTIALS: Required: Bachelor's or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.

Preferred: PhD in a relevant engineering discipline.

LOCATION: Austin, TX #LI-SC3 #LI-Hybrid
Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services.

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Required Skill Profession

Engineers