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Urgent! Lead Application Engineer, Advanced Packaging Materials Job Opening In Irvine – Now Hiring Sterling St. James, LLC

Lead Application Engineer, Advanced Packaging Materials



Job description

Principal Application Engineer, Advanced Packaging Materials


Irvine, California, United States


$, to $, + Bonus + Full Benefits + Paid Relocation


Overview


This position is for a Principal Application Engineer to join a global company that focuses on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies sector, specifically supporting the electronics industry.

The role involves providing high-level technical engineering support, developing extensive application expertise, and engaging directly with key clients.


Key Responsibilities


  • Technical Leadership: Acting as the technical lead on developmental and commercialized products by optimizing material application processes.




  • Customer Interaction: Engaging with customers directly to troubleshoot and resolve product and process-related issues.




  • Value Creation: Ensuring that customers can successfully utilize new and existing products in a way that delivers clear and tangible value.




  • Problem Solving: Addressing technology-specific fundamental problems associated with entire product lines or product classes through innovative approaches to application process development, troubleshooting, and material characterization.




  • Travel: This role may involve up to 10% travel.


  • What Makes You a Good Fit (Required Qualifications)


  • Education: At least a Bachelors degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or related fields.




  • Experience: 10+ years of experience in a chemical environment related to semiconductor advanced packaging.




  • Technical Expertise:

    A solid understanding of the latest Semiconductor Packaging trends, particularly 2.5D and 3D packaging.

    Expertise in wafer level encapsulation and molding processes in semiconductor packaging.



  • Communication: Strong verbal communication skills (one-on-one and group presentations) with excellent interpersonal skills.




  • Work Style: Demonstrated ownership, a customer-focused mindset, adept at project and time management to drive projects to completion, and the ability to work both collaboratively and independently.




  • Health Insurance: Affordable medical, dental, vision, and wellbeing plans starting on day 1.




  • Work-Life Balance: Paid time off (sick, vacation, holiday, volunteer time), flexible & hybrid work policies, and vacation buy/sell program.




  • Financial: k matching, annual performance bonus, employee share plan, service awards, and student loan reimbursement.




  • Family Support: Generous parental leave, fertility support, adoption reimbursement, discounted child and elderly care, and scholarship opportunities.




  • Career Growth: Wide range of growth opportunities, access to skills development courses, and tuition reimbursement.



  • Required Skill Profession

    Engineers



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