Urgent! Manager SiPh Packaging Architecture, Design, Modeling Job Opening In Round Lake – Now Hiring GLOBALFOUNDRIES
Job Opportunity at GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies.
With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.
Summary of Role
Build and lead a highly technical team of SiPh package design and modeling engineers to deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optic form factors meeting customer requirements.
The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design.
Focus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonic, and thermal definition for chiplet and product modules as well as reliability qualification approaches.
A successful candidate would possess assembly knowledge and expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions.
It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer and chip on substrate using a variety of assembly technologies.
Responsibilities
Drives high engagement and trust within their team and between teams to deliver beyond expectations.
Delivers results providing training and cross training to ensure high team continuity and effectiveness.
Drives team to use latest AI techniques for increased efficiency and productivity.
Leads team to establishment of manufacturing driven design rules and guidelines.
Ensures that all packaged products meet a standardized set of quality expectations by driving product packaging design reviews, materials selection and FMEAs of customer packaging concepts.
Drives SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
Provides tools and complex analysis for manufacturability, cost, and quality.
Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
Ensures standardization of site-based quality processes are executed appropriately.
Drives discipline and qualification robustness through a consistent global design process.
Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:
Perform project management and data analysis.
Support new customer products with innovative design solutions and technology design rules.
Work with cross function teams to resolve technical & yield concerns.
Develop and improve test structures that enable fast and rigorous characterization of process.
Drive CIP (Continuous improvement plans) to deliver organizational goals.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications
MS +7, or PhD + 5 or more years of experience.
Experience in bringing packaged products from development into production.
Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.
Package design and layout knowledge.
Strong written and spoken English communication skills.
Preferred Qualifications
Materials science, thermal, mechanical, simulation background.
Experience with failure analysis, design of experiments, and packaging process integration.
Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.
Expected Salary Range $107,400.00 - $204,500.00.
The exact salary will be determined based on qualifications, experience, and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@ and let us know the nature of your request and your contact information.
Requests for accommodation will be considered on a case-by-case basis.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential.
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Unlock Your Manager SiPh Potential: Insight & Career Growth Guide
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Great news! GLOBALFOUNDRIES is currently hiring and seeking a Manager SiPh Packaging Architecture, Design, Modeling to join their team. Feel free to download the job details.
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