Mechanical Engineer, Annapurna Labs, Machine Learning Hardware

Job description

Description
Annapurna Labs (our organization within AWS Utility Computing) designs silicon and software that accelerates innovation.

Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday.

Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

We are seeking experienced Hardware Design Engineers to build the next generation of our cloud server infrastructure.

Our success depends on our world-class server infrastructure; we’re handling massive scale and rapid integration of emergent technologies.

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers.

You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience.

This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas.

You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost.

We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
As a Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure.

You develop from the lowest levels of circuit design to large system design including thermal solutions and see those systems all the way through to high volume manufacturing.

Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.

About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS).

Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.

Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers.

Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
Basic Qualifications
- BS or MS degree in Mechanical/Thermal Engineering
- 5+ years industry experience in Mechanical and Thermal design of Systems
- Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
- 3+ years of experience SoC Thermal modelling and IC package transient thermal response
- Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
- Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
- Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.
Preferred Qualifications
- Knowledge of SoC mechanical design methodology, structural, and multi-physics analysis techniques for coupled structural-thermal-power
- Tool Familiarity: Ansys Mechanical, Workbench, Cadence Celsius, ABAQUS, PTC Creo, and Solidworks
- Developing detailed FEA models for SoC and Package structural-thermal co-analysis
- Working knowledge on component and system level stress analysis, warpage prediction and validation techniques, design optimization to reduce stresses within package and board, solder joint stresses, heatsink assembly load and pressure prediction.
- Hands-on experience with using lab metrologies for validating mechanical models through coplanarity, CTE, strain, pressure measurements on Hardware
- Knowledge of various types of technologies used for heatsink solutions, Thermal Interface Materials (TIMs), liquid cooling technologies, fans, valves, chillers, and CDUs
- Programming experience: Bash script, Shell script, Linux, Python, and Lua.

Familiarity with working in Linux environment is an added advantage

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers.

If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information.

If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

Our compensation reflects the cost of labor across several US geographic markets.

The base pay for this position ranges from $129,800/year in our lowest geographic market up to $212,800/year in our highest geographic market.

Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience.

Amazon is a total compensation company.

Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits.

For more information, please visit https://www.aboutamazon.com/workplace/employee-benefits .

This position will remain posted until filled.

Applicants should apply via our internal or external career site.

Required Skill Profession

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