Microelectronics Packaging Engineer (Hybrid)

Job description

**Job Description**
Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely.

You don t see it, but it s there.

Our employees work on the world s most advanced electronics from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet.

At Electronic Systems, you ll be among the brightest minds, working on the aerospace and defense industry s most difficult problems.

Drawing strength from our differences, we re innovating for the future.

And you can, too.

Our flexible work environment provides you a chance to change the world without giving up your personal life.

We put our customers first exemplified by our missions: We Protect Those Who Protect Us and We Innovate For Those Who Move The WorldTM.

Sound like a team you want to be a part of?

Come build your career with BAE Systems

In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions.

BAE Systems is seeking a recent college graduate with a degree in Electrical, Aerospace, Mechanical, or Materials Engineering to join our team as a Microelectronics Packaging Design Engineer.

As a key member of our team, you will have the opportunity to design and develop innovative microelectronics packages that support the next generation of Global Positioning (GPS) products and other platforms that enable national defense.

**Job Summary:**
In this entry-level role, you will work closely with experienced engineers to design, develop, and qualify state-of-the-art miniaturized electronic devices.

You will contribute to all phases of the engineering life cycle, including design, process development, and factory support.

This is an excellent opportunity to apply your knowledge of engineering principles to a dynamic and fast-paced field.

**Primary Responsibilities:**

+ Assist in the development of microelectronics packaging concepts and technologies
+ Participate in product development activities, including packaging design and road mapping efforts
+ Contribute to program pursuits and bid estimates
+ Support prototype package builds and evaluation efforts
+ Assist in the qualification of microelectronics packages
+ Participate in failure analysis for microelectronics packages
+ Provide support for factory transition of products and manufacturing of microelectronics assemblies

**Requirements:**

+ Bachelor of Science degree in Electrical, Mechanical, or Materials Engineering
+ Strong foundation in engineering principles and materials science
+ Interest in microelectronics packaging design and development
+ Excellent communication and teamwork skills

**What We Offer:**

+ Opportunity to work on cutting-edge microelectronics packaging design and development projects
+ Collaborative and dynamic work environment
+ Professional development and growth opportunities
+ Competitive salary and benefits package

If you are a motivated and enthusiastic recent graduate looking to start your career in mechanical engineering, we encourage you to apply for this exciting opportunity.

**Required Education, Experience, & Skills**

+ US Citizenship
+ All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)
+ Bachelor's degree in Engineering with focus onElectrical, Aerospace, Mechanical, or MaterialsEngineering

**Preferred Education, Experience, & Skills**

+ Microelectronics design and manufacturing assembly
+ Microelectronics packaging materials and materials properties
+ Electronic component reliability testing
+ Post wafer fabrication processes
+ Failure analysis techniques
+ Additive manufacturing
+ Wafer fabrication processes
+ Advanced thermal packaging design
+ RF packaging design

**Pay Information**
Full-Time Salary Range: $57866 - $98372

Please note: This range is based on our market pay structures.

However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.

Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being.

Regular employees scheduled to work 20 hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance.

We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance.

Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave.

Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards.

Other incentives may be available based on position level and/or job specifics.

**Microelectronics Packaging Engineer - (Hybrid)**

**116436BR**

EEO Career Site Equal Opportunity Employer.

Minorities .

females .

veterans .

individuals with disabilities .

sexual orientation .

gender identity .

gender expression

Required Skill Profession

Other General