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Urgent! Principal Application Engineer, Advanced Packaging Materials Job Opening In Irvine – Now Hiring Advisory and Consulting Services

Principal Application Engineer, Advanced Packaging Materials



Job description

Principal Application Engineer, Advanced Packaging Materials


Irvine, California, United States


$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation 


Overview


This role is for a Principal Application Engineer to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market.

The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers.


Key Responsibilities


  • Technical Leadership: Serve as the technical lead on developmental and commercialized products by optimizing material application processes.




  • Customer Interaction: Directly interact with customers to troubleshoot and solve product and process-related problems.




  • Value Creation: Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.




  • Problem Solving: Solve technology-specific fundamental problems associated with entire product lines and/or product classes using novel approaches to application process development, troubleshooting, and material characterization.




  • Travel: Traveling of up to 10% will be part of this role.


  • What Makes You a Good Fit (Required Qualifications)


  • Education: Minimum of a Bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.




  • Experience: 10+ years of experience working in a chemical environment for semiconductor advanced packaging.




  • Technical Expertise:

    Good understanding of the latest Semiconductor Packaging trends, especially 2.5D and 3D package.

    Expertise in wafer level encapsulation and molding process in semiconductor package.



  • Communication: Strong verbal communication skills (one-on-one and group presentations) with solid interpersonal skills.




  • Work Style: Strong ownership and responsibility with a customer-oriented mindset, effective in using project and time management skills to drive projects to completion, and the ability to work as a team member and independently.




  • Health Insurance: Affordable plans for medical, dental, vision, and wellbeing starting on day 1.




  • Work-Life Balance: Paid time off (sick, vacation, holiday, volunteer time), flexible & hybrid work policies (depending on role), and vacation buy / sell program.




  • Financial: 401k matching, employee share plan with voluntary investment / matching shares, annual performance bonus, service awards, and student loan reimbursement.




  • Family Support: 12-week gender neutral parental leave (up to 20 weeks for parents giving birth), fertility support, adoption & surrogacy reimbursement, discounted child and elderly care, and scholarships.




  • Career Growth: Diverse national and international growth opportunities, access to thousands of skills development courses, and tuition reimbursement.



  • Required Skill Profession

    Engineers



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