Urgent! Senior Mechanical Engineer - Microelectronics Packaging (Hybrid) Job Opening In Cedar Rapids – Now Hiring BAE Systems
**Job Description**
Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely.
You don t see it, but it s there.
Our employees work on the world s most advanced electronics from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet.
At Electronic Systems, you ll be among the brightest minds, working on the aerospace and defense industry s most difficult problems.
Drawing strength from our differences, we re innovating for the future.
And you can, too.
Our flexible work environment provides you a chance to change the world without giving up your personal life.
We put our customers first exemplified by our missions: We Protect Those Who Protect Us and We Innovate For Those Who Move The WorldTM.
Sound like a team you want to be a part of?
Come build your career with BAE Systems
In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions.
BAE Systems is looking for an experienced Mechanical Engineer with a passion for engineering and the desire to work in the world of Microelectronics Packaging Design.
Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that support the war fighter.
The position offers abundant opportunity to design and develop state of the art miniaturized electronic devices.
As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification, and factory support.
The successful applicant should be knowledgeable in microelectronics packaging concepts and technologies.
Primary Responsibilities:
+ Contribute to program pursuits and bid estimates
+ Participate in Microelectronics product development activities including packaging concept, preliminary/detailed board design and packaging road mapping efforts
+ Develop technologies required for next generation packages
+ Coordinate prototype package builds and evaluation efforts
+ Qualify microelectronics packages
+ Conduct failure analysis for microelectronics packages
+ Support factory transition of products
+ Provide manufacturing support for Microelectronics assemblies currently in production
**Required Education, Experience, & Skills**
+ US Citizenship
+ All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)
+ Bachelor's degree in Engineering with focus on Mechanical, Aerospace or Material Engineering and 4 years of direct microelectronics packaging related experienceor equivalent
**Preferred Education, Experience, & Skills**
+ Microelectronics design and manufacturing assembly
+ Microelectronics packaging materials and materials properties
+ Electronic component reliability testing
+ Post wafer fabrication processes
+ Failure analysis techniques
+ Additive manufacturing
+ Wafer fabrication processes
+ Advanced thermal packaging design
+ RF packaging design
**Pay Information**
Full-Time Salary Range: $86460 - $146982
Please note: This range is based on our market pay structures.
However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.
Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being.
Regular employees scheduled to work 20 hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance.
We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance.
Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave.
Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards.
Other incentives may be available based on position level and/or job specifics.
**Senior Mechanical Engineer - Microelectronics Packaging (Hybrid)**
**114793BR**
EEO Career Site Equal Opportunity Employer.
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Unlock Your Senior Mechanical Potential: Insight & Career Growth Guide
Real-time Senior Mechanical Jobs Trends in Cedar Rapids, United States (Graphical Representation)
Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph below. This graph displays the job market trends for Senior Mechanical in Cedar Rapids, United States using a bar chart to represent the number of jobs available and a trend line to illustrate the trend over time. Specifically, the graph shows 190359 jobs in United States and 925 jobs in Cedar Rapids. This comprehensive analysis highlights market share and opportunities for professionals in Senior Mechanical roles. These dynamic trends provide a better understanding of the job market landscape in these regions.
Great news! BAE Systems is currently hiring and seeking a Senior Mechanical Engineer Microelectronics Packaging (Hybrid) to join their team. Feel free to download the job details.
Wait no longer! Are you also interested in exploring similar jobs? Search now: Senior Mechanical Engineer Microelectronics Packaging (Hybrid) Jobs Cedar Rapids.
An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at BAE Systems adheres to the cultural norms as outlined by Expertini.
The fundamental ethical values are:The average salary range for a Senior Mechanical Engineer Microelectronics Packaging (Hybrid) Jobs United States varies, but the pay scale is rated "Standard" in Cedar Rapids. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.
Key qualifications for Senior Mechanical Engineer Microelectronics Packaging (Hybrid) typically include Other General and a list of qualifications and expertise as mentioned in the job specification. Be sure to check the specific job listing for detailed requirements and qualifications.
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Here are some tips to help you prepare for and ace your job interview:
Before the Interview:To prepare for your Senior Mechanical Engineer Microelectronics Packaging (Hybrid) interview at BAE Systems, research the company, understand the job requirements, and practice common interview questions.
Highlight your leadership skills, achievements, and strategic thinking abilities. Be prepared to discuss your experience with HR, including your approach to meeting targets as a team player. Additionally, review the BAE Systems's products or services and be prepared to discuss how you can contribute to their success.
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