Urgent! Silicon Photonics Flip-Chip Bonding Process Engineer Job Opening In Cupertino – Now Hiring Apple
**Role Number:** 200621514-0836
**Summary**
Imagine what you could do here.
At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly.
Bring passion and dedication to your job and there's no telling what you could accomplish.
Dynamic, smart people and inspiring, innovative technologies are the norm here.
The people who work here have reinvented entire industries with all Apple Hardware products.
The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it.
Join us to help deliver the next groundbreaking Apple product! Do you love working on challenges that no one has solved yet?
As a member of our dynamic group, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple’s customers every single day!
**Description**
Apple's Biophotonics team is seeking a Flip-Chip bonding process engineer to join their rapidly expanding silicon photonics group.
This individual will work on the research and development of novel integrated photonics devices in sensing applications, being primarily responsible for day-to-day operation, reporting, and documentation of a high-precision flip-chip bonding process.
As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.
**Minimum Qualifications**
+ BS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field.
+ Background in semiconductor process integration, particularly in the back-end section of the manufacturing process.
**Preferred Qualifications**
+ 3+ years of relevant industry experience.
+ MS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field, with a background in semiconductor processing/fabrication.
+ Hands-on experience with die bonder tools and processes, or similar high precision assembly tool (flip-chip eutectic AuSn bonding experience beneficial).
+ Experience working in a cleanroom environment setting.
+ Strong problem solving ability and experience with material inspection, e.g. optical microscopes, metrology tools, etc.
+ Electrical and optical test experience.
+ Knowledge of statistical data analysis, with expertise in using relevant tools (e.g., JMP).
+ Excellent communication skills, with the ability to work effectively in a team with diverse expertises.
**Pay & Benefits**
At Apple, base pay is one part of our total compensation package and is determined within a range.
This provides the opportunity to progress as you grow and develop within a role.
The base pay range for this role is between $147,400 and $272,100, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs.
Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan.
You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition.
Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation.
Learn more about Apple Benefits.
(https://www.apple.com/careers/us/benefits.html)
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity.
We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
Learn more about your EEO rights as an applicant (https://www.eeoc.gov/sites/default/files/2023-06/22-088_EEOC_KnowYourRights6.12ScreenRdr.pdf) .
✨ Smart • Intelligent • Private • Secure
Practice for Any Interview Q&A (AI Enabled)
Predict interview Q&A (AI Supported)
Mock interview trainer (AI Supported)
Ace behavioral interviews (AI Powered)
Record interview questions (Confidential)
Master your interviews
Track your answers (Confidential)
Schedule your applications (Confidential)
Create perfect cover letters (AI Supported)
Analyze your resume (NLP Supported)
ATS compatibility check (AI Supported)
Optimize your applications (AI Supported)
O*NET Supported
O*NET Supported
O*NET Supported
O*NET Supported
O*NET Supported
European Union Recommended
Institution Recommended
Institution Recommended
Researcher Recommended
IT Savvy Recommended
Trades Recommended
O*NET Supported
Artist Recommended
Researchers Recommended
Create your account
Access your account
Create your professional profile
Preview your profile
Your saved opportunities
Reviews you've given
Companies you follow
Discover employers
O*NET Supported
Common questions answered
Help for job seekers
How matching works
Customized job suggestions
Fast application process
Manage alert settings
Understanding alerts
How we match resumes
Professional branding guide
Increase your visibility
Get verified status
Learn about our AI
How ATS ranks you
AI-powered matching
Join thousands of professionals who've advanced their careers with our platform
Unlock Your Silicon Photonics Potential: Insight & Career Growth Guide
Real-time Silicon Photonics Jobs Trends in Cupertino, United States (Graphical Representation)
Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph below. This graph displays the job market trends for Silicon Photonics in Cupertino, United States using a bar chart to represent the number of jobs available and a trend line to illustrate the trend over time. Specifically, the graph shows 745 jobs in United States and 124 jobs in Cupertino. This comprehensive analysis highlights market share and opportunities for professionals in Silicon Photonics roles. These dynamic trends provide a better understanding of the job market landscape in these regions.
Great news! Apple is currently hiring and seeking a Silicon Photonics Flip Chip Bonding Process Engineer to join their team. Feel free to download the job details.
Wait no longer! Are you also interested in exploring similar jobs? Search now: Silicon Photonics Flip Chip Bonding Process Engineer Jobs Cupertino.
An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at Apple adheres to the cultural norms as outlined by Expertini.
The fundamental ethical values are:The average salary range for a Silicon Photonics Flip Chip Bonding Process Engineer Jobs United States varies, but the pay scale is rated "Standard" in Cupertino. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.
Key qualifications for Silicon Photonics Flip Chip Bonding Process Engineer typically include Other General and a list of qualifications and expertise as mentioned in the job specification. Be sure to check the specific job listing for detailed requirements and qualifications.
To improve your chances of getting hired for Silicon Photonics Flip Chip Bonding Process Engineer, consider enhancing your skills. Check your CV/Résumé Score with our free Resume Scoring Tool. We have an in-built Resume Scoring tool that gives you the matching score for each job based on your CV/Résumé once it is uploaded. This can help you align your CV/Résumé according to the job requirements and enhance your skills if needed.
Here are some tips to help you prepare for and ace your job interview:
Before the Interview:To prepare for your Silicon Photonics Flip Chip Bonding Process Engineer interview at Apple, research the company, understand the job requirements, and practice common interview questions.
Highlight your leadership skills, achievements, and strategic thinking abilities. Be prepared to discuss your experience with HR, including your approach to meeting targets as a team player. Additionally, review the Apple's products or services and be prepared to discuss how you can contribute to their success.
By following these tips, you can increase your chances of making a positive impression and landing the job!
Setting up job alerts for Silicon Photonics Flip Chip Bonding Process Engineer is easy with United States Jobs Expertini. Simply visit our job alerts page here, enter your preferred job title and location, and choose how often you want to receive notifications. You'll get the latest job openings sent directly to your email for FREE!