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Urgent! Advanced Packaging Engineer – High-Performance Systems Integration Job Opening In Saratoga – Now Hiring Piper Companies

Advanced Packaging Engineer – High Performance Systems Integration



Job description

We are seeking a highly experienced Advanced Packaging Engineer with deep expertise in substrate layout, system integration, and packaging technologies.

This is a high-impact, on-site role focused on advanced organic substrate layout, routing feasibility, and co-design alignment across floorplanning, mechanical, and system-level constraints.

You’ll be part of a small, expert team shaping the physical implementation of a first-of-its-kind high-performance package.

This position is a hybrid role located in Saratoga, California.

Responsibilities of the Advanced Packaging Engineer:

  • Drive initiatives for advanced packaging technologies, including substrate layout and system-level integration
  • Collaborate closely with TSMC in Taiwan and local engineering teams to develop and implement packaging solutions
  • Lead co-design efforts across electrical, mechanical, and thermal domains to ensure alignment with system-level constraints
  • Evaluate and optimize routing feasibility and substrate design for high-performance applications
  • Integrate advanced packaging technologies such as CoWoS into system architectures
  • Support cross-functional teams in the development of 2.5D/3D stacking and heterogeneous integration solutions
  • Qualifications of the Advanced Packaging Engineer:

  • + years of experience in advanced packaging technology development and system integration
  • Proven ability to wear multiple hats and lead cross-functional initiatives across global teams
  • Deep understanding of CoWoS technology and its application in high-performance systems
  • Strong system-level background with experience integrating packages into full systems
  • Knowledge of 3D stacking and heterogeneous integration (preferred)
  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, or related field
  • Background in Materials Science is helpful; Master’s degree is a plus
  • Compensation of the Advanced Packaging Engineer:

  • Salary Range: $, – $,, based on experience
  • Location: On-site (U.S. based)
  • Benefits: Medical, Dental, Vision, K, PTO, parental leave, and sick leave as required by law
  • Application Details:

  • Job opens for applications on: /
  • Applications will be accepted for at least days from the posting date
  • Keywords:

    Advanced Packaging, CoWoS, Substrate Layout, System Integration, TSMC, 3D Stacking, Organic Substrate, High-Performance Computing, Mechanical Engineering, Electrical Engineering, Materials Science, Floorplanning, Routing Feasibility, Heterogeneous Integration

    #LI-KI1 #LI-HYBRID


    Required Skill Profession

    Engineers



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